Thursday, April 15, 2010

X-Ray Analysis to Identify Counterfeit Components

One of the many techniques used to identify and discover counterfeit electronic components is X-Ray Inspection.  Oxygen Electronics has onsite a Nicolet NXR1525 X-Ray Inspection System. 

By comparing the internal structure (of a homogeneous sample, same date & lot code) of electronic components certain types of counterfeit parts can be discovered.  The "blatant fake" counterfeit devices exhibit vast differences in internal structure including, but not limited to different Die Frames and Different Wire Bonding.

The following example is a SSW524 where were identical date and lot code packaged on tape in reel.  Note the drastic differences in internal structure.  Additional comparisons to a data sheet revel pin-out discrepancies.

























Another example of a potentially counterfeit device is SAA1029.  During X-Ray inspection different internal Die Frane Construction was noted on parts that had identical date and lot codes.

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