Friday, March 25, 2011

SiliconExpert Releases Report on Japanese Earthquake’s Impact on the Electronics Industry

25 March 2011 -- Today SiliconExpert Technologies releases a supply chain report on the impact of the March 11th Japanese earthquake and ensuing tsunami on the global electronics industry. The report analyzes over 150 manufacturing sites from electronic component manufacturers with locations in Japan. Damage assessments and product types impacted due to the earthquake and ensuing tsunami are also listed alongside confirmation reports from electronic component manufacturers.

The report’s findings show a large number of electronic component manufacturers reporting low to partial impacts to manufacturing facilities with impacts to product lines ranging from ceramic capacitors, transistors and diodes to flash memory and circuit modules. Reported estimates for recovery to full production levels range from a few weeks to several months. A select number of component manufacturers have also reported a high degree of damage to their manufacturing facilities with no concrete time estimates yet given for reaching a full recovery of their production capabilities.

“The human and economic impact due to the Japanese earthquake and tsunami is quite substantial. We will continue to assess the situation for the next several months to keep our customers and the electronics industry informed of the supply chain issues that are arising due to the situation at hand,” says Omar Ahmad, President & CEO of SiliconExpert Technologies.

To download a free copy of SiliconExpert’s report “Impacts of the Japanese Earthquake on the Electronics Industry”, please visit http://download.siliconexpert.com/mkt/lps/japanearthquake_report/japan_earthquake_report_2011.html

Thursday, March 24, 2011

ESC75E10 Glenair Connector Available from Stock

Oxygen Electronics has a limited quantity Genair Connector ESC75E10 in stock.


Photo of ESC75E10 by Glenair
For more information visit: Photo and Datasheets

Japan Earthquake affect on Auto Electronic Makers

Japan Earthquake affect on Auto Electronic Makers .

For complete update information, please visit Oxygen Electronics Japan Earthquake Updates.

For any questions or comments please email us at sales@o2xygen.com or please visit our homepage at Oxygen Electronics .

Wednesday, March 23, 2011

V103YLF: Received Today

Oxygen Electronics received part number V103YLF today. For more information about this part, please click here.

For questions or comments please email us at sales@o2xygen.com or visit our home page at Oxygen Electronics .

Also,for complete update information, please visit Oxygen Electronics Japan Earthquake Updates

Tuesday, March 22, 2011

X-Ray as a Tool to Identify Counterfeit Electronic Components

Utilizing X-Ray inspection can be beneficial in detecting counterfeit components during goods inward inspection for plastic components.  During X-Ray inspection the Die Size, Wire Bonding, and Die Frame are compared to ensure consistancy of construction.  While X-Ray inspection isn't a 100% guarantee that a component is authentic, when combined with other advanced inspection techniques, it provides a much higher level of confidence in the authenticity of a product.  This is particularly so for a product for which there is limited or no traceability to the component manufacturer.

In the following example X-Ray inspection was performed on an Agilet HCPL3101 (Datasheet and Photo of HCPL3101).  Evidence of the Die and Wire Bonding is evident in the center of the X-Ray Image.  Wire Bonding from the Die to the Pins is also evident and the non-connect pins are consistant with the MFG datasheet.
X-Ray Image of HCPL3101

The second example of X-Ray inspection was performed on a MC14163BCL (Datasheet and Photos).  As this part is a Ceramic DIL package the beam power required to penetrate the ceramic body causes much of the inside of the component to be "washed out."  Very sophisticated and very expensive equiptment is required to be able to identify the Die Frame, Die, and Wire Bonding in the same image during X-Ray inspection.  The below images would lead the viewer to think there was no wire bonding between the Die and the Pins.  Despite the X-Ray images not showing this evidence, wire bonding and the die was discovered when the component was de-capped.

X-Ray Image of MC14163BCL


In the next example part number M5M51008BFP-70LLI (Datasheet and Photos) was inspected using an X-Ray.  In the below image it is evident that Pin 1 is a non-connect pin which is consistant with the manufacturers datasheet.

X-Ray Image M5M51008BFP-70LLI






































Oxygen Electronics LLC uses a Nicolet NXR1525 X-Ray in an ANSI ESD S20.20 environment.
Nicolet NXR1525

Global Chip Production Devastated after Japan Earthquake

Japan Earthquake hits Global Chip Production.

For complete update information, please visit Oxygen Electronics Japan Earthquake Updates .

Delphi Update

Delphi Update after catastrohpic Earthquake and Tsunami in Japan.

For complete update information, please visit Oxygen Electronics Japan Earthquake Updates

Kuhne+Nagel Newsletter Following the Japan Earthquake

Most recent Kuhne+Nagel Newsletter after the Devastating Japan Earthquake and Tsunami.

For complete update information, please visit Oxygen Electronics Japan Earthquake Updates

More Affects of the Japan Earthquake

25% of Global Production of Silicon Wafers Suspended.

Disruptions for Nokia.

Renesas: Trouble to Restart Production.

For complete update information, please visit Oxygen Electronics Japan Earthquake Updates.

SONY Production

Brownouts affect SONY Production .

For complete update information, please visit Oxygen Electronics Japan Earthquake Updates

Monday, March 21, 2011

DFLS230L7: Received Today

Oxygen Electronics received a batch of DFLS230L7 today. For more information about this Diodes Zetex part including pictures and a data sheet please click here .

For questions or comments, please email us at sales@o2xygen.com

Also for complete updated information on the Japan Eathquake, please visit Oxygen Electronics Japan Earthquake Updates .

Digitimes Insight: affect on HDD Industry

Digitimes Insight: Japan earthquake to affect HDD industry

For complete update information, please visit Oxygen Electronics Japan Earthquake Updates

Catastrophe in Japan: Hard Discs in French

Catastrophe in Japan:Consequences for the hard discs. This article is in French.

For complete update information, please visit Oxygen Electronics Japan Earthquake Updates