Monday, March 28, 2011
ON Semiconductor Reopens 2 Plants in Japan
Friday, March 25, 2011
SiliconExpert Releases Report on Japanese Earthquake’s Impact on the Electronics Industry
The report’s findings show a large number of electronic component manufacturers reporting low to partial impacts to manufacturing facilities with impacts to product lines ranging from ceramic capacitors, transistors and diodes to flash memory and circuit modules. Reported estimates for recovery to full production levels range from a few weeks to several months. A select number of component manufacturers have also reported a high degree of damage to their manufacturing facilities with no concrete time estimates yet given for reaching a full recovery of their production capabilities.
“The human and economic impact due to the Japanese earthquake and tsunami is quite substantial. We will continue to assess the situation for the next several months to keep our customers and the electronics industry informed of the supply chain issues that are arising due to the situation at hand,” says Omar Ahmad, President & CEO of SiliconExpert Technologies.
To download a free copy of SiliconExpert’s report “Impacts of the Japanese Earthquake on the Electronics Industry”, please visit http://download.siliconexpert.com/mkt/lps/japanearthquake_report/japan_earthquake_report_2011.html
Thursday, March 24, 2011
ESC75E10 Glenair Connector Available from Stock
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Japan Earthquake affect on Auto Electronic Makers
For complete update information, please visit Oxygen Electronics Japan Earthquake Updates.
For any questions or comments please email us at sales@o2xygen.com or please visit our homepage at Oxygen Electronics .
Wednesday, March 23, 2011
V103YLF: Received Today
For questions or comments please email us at sales@o2xygen.com or visit our home page at Oxygen Electronics .
Also,for complete update information, please visit Oxygen Electronics Japan Earthquake Updates
Tuesday, March 22, 2011
X-Ray as a Tool to Identify Counterfeit Electronic Components
In the following example X-Ray inspection was performed on an Agilet HCPL3101 (Datasheet and Photo of HCPL3101). Evidence of the Die and Wire Bonding is evident in the center of the X-Ray Image. Wire Bonding from the Die to the Pins is also evident and the non-connect pins are consistant with the MFG datasheet.
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| X-Ray Image of HCPL3101 |
The second example of X-Ray inspection was performed on a MC14163BCL (Datasheet and Photos). As this part is a Ceramic DIL package the beam power required to penetrate the ceramic body causes much of the inside of the component to be "washed out." Very sophisticated and very expensive equiptment is required to be able to identify the Die Frame, Die, and Wire Bonding in the same image during X-Ray inspection. The below images would lead the viewer to think there was no wire bonding between the Die and the Pins. Despite the X-Ray images not showing this evidence, wire bonding and the die was discovered when the component was de-capped.
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| X-Ray Image of MC14163BCL |
In the next example part number M5M51008BFP-70LLI (Datasheet and Photos) was inspected using an X-Ray. In the below image it is evident that Pin 1 is a non-connect pin which is consistant with the manufacturers datasheet.
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| X-Ray Image M5M51008BFP-70LLI |
Oxygen Electronics LLC uses a Nicolet NXR1525 X-Ray in an ANSI ESD S20.20 environment.
| Nicolet NXR1525 |
Global Chip Production Devastated after Japan Earthquake
For complete update information, please visit Oxygen Electronics Japan Earthquake Updates .
Delphi Update
For complete update information, please visit Oxygen Electronics Japan Earthquake Updates
Kuhne+Nagel Newsletter Following the Japan Earthquake
For complete update information, please visit Oxygen Electronics Japan Earthquake Updates
SONY Production
For complete update information, please visit Oxygen Electronics Japan Earthquake Updates
Monday, March 21, 2011
DFLS230L7: Received Today
For questions or comments, please email us at sales@o2xygen.com
Also for complete updated information on the Japan Eathquake, please visit Oxygen Electronics Japan Earthquake Updates .
Digitimes Insight: affect on HDD Industry
For complete update information, please visit Oxygen Electronics Japan Earthquake Updates
Catastrophe in Japan: Hard Discs in French
For complete update information, please visit Oxygen Electronics Japan Earthquake Updates
Friday, March 18, 2011
Effects of Japan Earthquake on Electronic Industry in French
For complete update information, please visit Oxygen Electronics Japan Earthquake Updates
Effects of Sendai Earthquake on Technology Supplies
For complete update information, please visit Oxygen Electronics Japan Earthquake Updates
Thursday, March 17, 2011
7MBR15SA12050: Arrived Today
For an questions or comments, please email us at sales@o2xygen.com
Or please visit our website, http://www.o2xygen.com/.
Fairchild Semiconductor Updates
For complete update information, please visit Oxygen Electronics Japan Earthquake Updates
Molex Incorporated Updates
For complete update information, please visit Oxygen Electronics Japan Earthquake Updates
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